Combined TPD and XPS Study of Ligation and Decomposition of 1,6-Hexanedithiol on Size-Selected Copper Clusters Supported on HOPG

dc.contributor.authorWang, Linjie
dc.contributor.authorBlando, Nicolas
dc.contributor.authorHicks, Zachary
dc.contributor.authorDenchy, Michael
dc.contributor.authorTang, Xin
dc.contributor.authorBleuel, Hannes
dc.contributor.authorZhang, Mingshi
dc.contributor.authorGanteför, Gerd
dc.contributor.authorBowen, Kit H.
dc.date.accessioned2018-03-08T07:51:32Z
dc.date.available2018-03-08T07:51:32Z
dc.date.issued2018-02eng
dc.description.abstractLigation and decomposition of 1,6-hexanedithiol on copper clusters have been studied by means of temperature-programmed desorption (TPD) and X-ray photoelectron spectroscopy (XPS). Copper cluster anions were first made via magnetron sputtering, then size selected and soft landed into a frozen matrix of 1,6-hexandithiol on highly ordered pyrolytic graphite (HOPG) maintained at 100 K. After warming up to 298 K, a combination of TPD and XPS were performed to characterize the newly deposited sample. TPD data shed light upon the adsorption and decomposition pathways of 1,6-hexanedithiol molecules on copper clusters. Based on the TPD data, two different binding motifs are proposed: the dangling motif is with one sulfur atom binding to a copper cluster, and the bidentate motif is with both sulfur atoms binding to a copper cluster. Different decomposition products were observed for each binding motif. A series of hydrogen atom titration experiments were designed to provide further evidence for the proposed decomposition mechanism. XPS measurements at varied temperatures agree well with the TPD profile by confirming the formation of dithiol ligated copper clusters through Cu–S bond formation, and the decomposition of them via C–S bond scission. How well the dithiol ligand can protect the copper clusters from being oxidized is discussed, and the ligand number per cluster is estimated.eng
dc.description.versionpublishedeng
dc.identifier.doi10.1021/acs.jpcc.7b10452eng
dc.identifier.urihttps://kops.uni-konstanz.de/handle/123456789/41723
dc.language.isoengeng
dc.subject.ddc530eng
dc.titleCombined TPD and XPS Study of Ligation and Decomposition of 1,6-Hexanedithiol on Size-Selected Copper Clusters Supported on HOPGeng
dc.typeJOURNAL_ARTICLEeng
dspace.entity.typePublication
kops.citation.bibtex
@article{Wang2018-02Combi-41723,
  year={2018},
  doi={10.1021/acs.jpcc.7b10452},
  title={Combined TPD and XPS Study of Ligation and Decomposition of 1,6-Hexanedithiol on Size-Selected Copper Clusters Supported on HOPG},
  number={4},
  volume={122},
  issn={1932-7447},
  journal={The Journal of Physical Chemistry C},
  pages={2173--2183},
  author={Wang, Linjie and Blando, Nicolas and Hicks, Zachary and Denchy, Michael and Tang, Xin and Bleuel, Hannes and Zhang, Mingshi and Ganteför, Gerd and Bowen, Kit H.}
}
kops.citation.iso690WANG, Linjie, Nicolas BLANDO, Zachary HICKS, Michael DENCHY, Xin TANG, Hannes BLEUEL, Mingshi ZHANG, Gerd GANTEFÖR, Kit H. BOWEN, 2018. Combined TPD and XPS Study of Ligation and Decomposition of 1,6-Hexanedithiol on Size-Selected Copper Clusters Supported on HOPG. In: The Journal of Physical Chemistry C. 2018, 122(4), pp. 2173-2183. ISSN 1932-7447. eISSN 1932-7455. Available under: doi: 10.1021/acs.jpcc.7b10452deu
kops.citation.iso690WANG, Linjie, Nicolas BLANDO, Zachary HICKS, Michael DENCHY, Xin TANG, Hannes BLEUEL, Mingshi ZHANG, Gerd GANTEFÖR, Kit H. BOWEN, 2018. Combined TPD and XPS Study of Ligation and Decomposition of 1,6-Hexanedithiol on Size-Selected Copper Clusters Supported on HOPG. In: The Journal of Physical Chemistry C. 2018, 122(4), pp. 2173-2183. ISSN 1932-7447. eISSN 1932-7455. Available under: doi: 10.1021/acs.jpcc.7b10452eng
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kops.sourcefieldThe Journal of Physical Chemistry C. 2018, <b>122</b>(4), pp. 2173-2183. ISSN 1932-7447. eISSN 1932-7455. Available under: doi: 10.1021/acs.jpcc.7b10452deu
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kops.sourcefield.plainThe Journal of Physical Chemistry C. 2018, 122(4), pp. 2173-2183. ISSN 1932-7447. eISSN 1932-7455. Available under: doi: 10.1021/acs.jpcc.7b10452eng
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