Squeezing of thermal fluctuations in a driven nanomechanical resonator

dc.contributor.authorHuber, Jana S.
dc.contributor.authorRastelli, Gianluca
dc.contributor.authorSeitner, Maximilian J.
dc.contributor.authorKölbl, Johannes
dc.contributor.authorBelzig, Wolfgang
dc.contributor.authorDykman, Mark I.
dc.contributor.authorWeig, Eva M.
dc.date.accessioned2019-03-21T13:13:12Z
dc.date.available2019-03-21T13:13:12Z
dc.date.issued2019-03-18T17:48:41Zeng
dc.description.abstractClassical squeezing allows manipulating the noise distribution of thermal fluctuations by suppressing the noise along one of the two quadratures. Squeezing of thermal fluctuations has mostly been studied in parametric amplifiers, including realizations based on microwave [1,2] or mechanical [3,4] resonators as well as trapped ions [5], and is typically detected in a homodyne measurement. Here we show thermal squeezing of a nanomechanical resonator of ultra-high quality factor at room temperature. Squeezing is accomplished by driving the resonator in the nonlinear Duffing regime. Contrary to previous studies [6-8], auxilliary noise injection into the system is not required. Remarkably, the squeezing manifests itself directly in the power spectrum without the need of a homodyne measurement. Classical noise squeezing promises to reduce heating in computers [9], and represents an important asset for precision sensing [5,10,11] enabling the advent of a new generation of nanomechanical detectors at room temperature.eng
dc.description.versionpublishedeng
dc.identifier.arxiv1903.07601eng
dc.identifier.ppn1662407149
dc.identifier.urihttps://kops.uni-konstanz.de/handle/123456789/45536
dc.language.isoengeng
dc.rightsterms-of-use
dc.rights.urihttps://rightsstatements.org/page/InC/1.0/
dc.subject.ddc530eng
dc.titleSqueezing of thermal fluctuations in a driven nanomechanical resonatoreng
dc.typeWORKINGPAPEReng
dspace.entity.typePublication
kops.description.openAccessopenaccessgreen
kops.flag.knbibliographytrue
kops.identifier.nbnurn:nbn:de:bsz:352-2-1qsv60wuvkhfj6
temp.submission.doi
temp.submission.source

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2019-05-21 10:57:21
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