Large-area sub-micron gap interdigitated THz emitters fabricated by interference lithography and angle evaporation
| Publikationstyp: | Zeitschriftenartikel |
| URI (zitierfähiger Link): | http://nbn-resolving.de/urn:nbn:de:bsz:352-opus-85728 |
| Autor/innen: | Huska, Klaus; Klatt, Gregor; Hetterich, Jurana; Geyer, Ulf; Dekorsy, Thomas; Bastian, Georg; Lemmer, Uli |
| Erscheinungsjahr: | 2009 |
| Erschienen in: | Electronics Letters ; 45 (2009), 16. - S. 851-853 |
| DOI (zitierfähiger Link): | https://dx.doi.org/10.1049/el.2009.1648 |
| Zusammenfassung: |
Interference-lithography and a self-aligning angle-evaporation technique are employed to fabricate interdigitated photoconductive terahertz (THz) emitters. The devices have a large active area for high directivity and submicron spaced electrodes for high internal electric fields at low bias voltages. The fabrication process offers the advantage that only one patterning step is needed to generate three isolated metallic structures. This avoids critical alignment and reduces the fabrication effort significantly. Voltage dependent THz emission is observed from 4 V upwards.
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| Fachgebiet (DDC): | 530 Physik |
| Link zur Lizenz: | Nutzungsbedingungen |
| Universitätsbibliographie: | Ja |
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HUSKA, Klaus, Gregor KLATT, Jurana HETTERICH, Ulf GEYER, Thomas DEKORSY, Georg BASTIAN, Uli LEMMER, 2009. Large-area sub-micron gap interdigitated THz emitters fabricated by interference lithography and angle evaporation. In: Electronics Letters. 45(16), pp. 851-853. Available under: doi: 10.1049/el.2009.1648
@article{Huska2009Large-9287, title={Large-area sub-micron gap interdigitated THz emitters fabricated by interference lithography and angle evaporation}, year={2009}, doi={10.1049/el.2009.1648}, number={16}, volume={45}, journal={Electronics Letters}, pages={851--853}, author={Huska, Klaus and Klatt, Gregor and Hetterich, Jurana and Geyer, Ulf and Dekorsy, Thomas and Bastian, Georg and Lemmer, Uli} }
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Dateiabrufe seit 01.10.2014 (Informationen über die Zugriffsstatistik)
| ElecLett45200916.pdf | 147 |
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