Laser-induced Particle Removal from Silicon Wafers

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LEIDERER, Paul, Johannes BONEBERG, Volker DOBLER, Mario MOSBACHER, Hans-Joachim MÜNZER, Nouari CHAOUI, Jan Philip SIEGEL, Francisco Javier SOLIS CESPEDES, Carmen Nieves AFONSO RODRIGUEZ, T. FOURRIER, Gernot SCHREMS, Dieter BÄUERLE, 2000. Laser-induced Particle Removal from Silicon Wafers. High-Power Laser Ablation III. Santa Fe, NM, USA. In: Proceedings of SPIE. High-Power Laser Ablation III. Santa Fe, NM, USA. SPIE, pp. 249-259. eISSN 0277-786X. Available under: doi: 10.1117/12.407353

@inproceedings{Leiderer2000Laser-4968, title={Laser-induced Particle Removal from Silicon Wafers}, year={2000}, doi={10.1117/12.407353}, publisher={SPIE}, booktitle={Proceedings of SPIE}, pages={249--259}, author={Leiderer, Paul and Boneberg, Johannes and Dobler, Volker and Mosbacher, Mario and Münzer, Hans-Joachim and Chaoui, Nouari and Siegel, Jan Philip and Solis Cespedes, Francisco Javier and Afonso Rodriguez, Carmen Nieves and Fourrier, T. and Schrems, Gernot and Bäuerle, Dieter} }

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