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Influence of saw damage etching on the mechanical stability of multi-crystalline wafers

Influence of saw damage etching on the mechanical stability of multi-crystalline wafers

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BEHNKEN, Herfried, Rüdiger TIEFERS, Wolfgang KRÜHLER, Armin FROITZHEIM, Giso HAHN, Dieter FRANKE, 2004. Influence of saw damage etching on the mechanical stability of multi-crystalline wafers. 19th European Photovoltaic Solar Energy Conference. Paris, 7. Jun 2004 - 11. Jun 2004. In: HOFFMANN, W., ed. and others. Nineteenth European Photovoltaic Solar Energy Conference : proceedings of the international conference held in Paris, France, 7 - 11 June 2004. München:WIP-Munich, pp. 1123-1126. ISBN 3-936338-15-9

@inproceedings{Behnken2004Influ-31378, title={Influence of saw damage etching on the mechanical stability of multi-crystalline wafers}, year={2004}, isbn={3-936338-15-9}, address={München}, publisher={WIP-Munich}, booktitle={Nineteenth European Photovoltaic Solar Energy Conference : proceedings of the international conference held in Paris, France, 7 - 11 June 2004}, pages={1123--1126}, editor={Hoffmann, W.}, author={Behnken, Herfried and Tiefers, Rüdiger and Krühler, Wolfgang and Froitzheim, Armin and Hahn, Giso and Franke, Dieter} }

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