The origin of background plating

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BRAUN, Stefan, Annika ZUSCHLAG, Bernd RAABE, Giso HAHN, 2011. The origin of background plating. In: Energy Procedia. 8, pp. 565-570. ISSN 1876-6102. Available under: doi: 10.1016/j.egypro.2011.06.183

@article{Braun2011origi-15919, title={The origin of background plating}, year={2011}, doi={10.1016/j.egypro.2011.06.183}, volume={8}, issn={1876-6102}, journal={Energy Procedia}, pages={565--570}, author={Braun, Stefan and Zuschlag, Annika and Raabe, Bernd and Hahn, Giso} }

Raabe, Bernd eng Braun, Stefan Zuschlag, Annika 2011-09-29T06:59:10Z In the last years efforts were made to overcome the widespread screen printing metallization technique to reduce shading of the front side, increase the finger conductivity, and improve the contact properties of the metallization of crystalline silicon solar cells. A promising approach is plating via wet chemical metal deposition. Hereby, the metals nickel as contact layer and copper or silver as conduction layer are alternatives to the thick film screen printing process. One challenge using this technique is to avoid the unwanted background plating where the metal is not only deposited on the opened emitter structures but also partly on the isolating surface of the silicon nitride layer.<br /><br />In this paper a detailed overview of the origin of background plating is given, documented by scanning electron microscope pictures. By cutting a groove in the surface of the sample and milling the unwanted metallization as well as the silicon underneath in 12.5 nm steps with a focused gallium ion beam, it was possible to investigate the cross sections by EDX and reveal different origins for the background plating behavior. 2011-09-29T06:59:10Z Braun, Stefan Zuschlag, Annika Raabe, Bernd Hahn, Giso 2011 Hahn, Giso The origin of background plating Attribution-NonCommercial-NoDerivs 3.0 Unported Publ. in: Energy Procedia ; 8 (2011). - pp. 565-570

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