Universal threshold for the steam laser cleaning of submicron spherical particles from silicon

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The efficiency of the steam laser cleaning process is examined. For the investigation of the physics of particle removal from the particularly interesting surface of silicon we have deposited well-characterized spherical polymer and silica particles of different diameters ranging from several tens to hundreds of nanometers on commercial wafers. As a result of our systematic study we observe a sharp threshold of the steam cleaning process at 110 mJ/cm2 (h=532 nm, FWHMD=7 ns) which is independent of the size (for particles with diameters as small as 60 nm) and material of the particles. An efficiency above 90% after 20 cleaning steps is reached at a laser fluence of 170 mJ/cm2. Experiments with irregularly shaped alumina particles exhibit the same threshold as for spherical particles.

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ISO 690MOSBACHER, Mario, Volker DOBLER, Johannes BONEBERG, Paul LEIDERER, 2000. Universal threshold for the steam laser cleaning of submicron spherical particles from silicon. In: Applied Physics / A, Materials Science and Processing. 2000, 70(6), pp. 669-672. Available under: doi: 10.1007/PL00021079
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@article{Mosbacher2000Unive-5196,
  year={2000},
  doi={10.1007/PL00021079},
  title={Universal threshold for the steam laser cleaning of submicron spherical particles from silicon},
  number={6},
  volume={70},
  journal={Applied Physics / A, Materials Science and Processing},
  pages={669--672},
  author={Mosbacher, Mario and Dobler, Volker and Boneberg, Johannes and Leiderer, Paul}
}
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