Publikation: Matrix laser cleaning: a new technique for the removal of nanometer sized particles from semiconductors
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2007
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Graf, Johannes
Luk'jancuk, Boris S.
Hong, Ming Hui
Chong, Chong T.
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Applied Physics. 2007, 88(2), pp. 277-230. Available under: doi: 10.1007/s00339-007-4017-6
Zusammenfassung
In this paper a new laser-based technique for the removal of nanoparticles from silicon wafers, called matrix laser cleaning, is introduced. In contrast to the already existing technique dry laser cleaning damages of the substrate can be avoided. Furthermore no liquids are used, avoiding problems that occur, e.g. in steam laser cleaning and other wet cleaning techniques. We show that damage free particle removal of polystyrene particles with diameters of at least down to 50 nm is possible with a cleaning efficiency very close to 100% within a single shot experiment. Furthermore the cleaning threshold is independent of the particle size.
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GRAF, Johannes, Boris S. LUK'JANCUK, Mario MOSBACHER, Ming Hui HONG, Chong T. CHONG, Johannes BONEBERG, Paul LEIDERER, 2007. Matrix laser cleaning: a new technique for the removal of nanometer sized particles from semiconductors. In: Applied Physics. 2007, 88(2), pp. 277-230. Available under: doi: 10.1007/s00339-007-4017-6BibTex
@article{Graf2007Matri-5307,
year={2007},
doi={10.1007/s00339-007-4017-6},
title={Matrix laser cleaning: a new technique for the removal of nanometer sized particles from semiconductors},
number={2},
volume={88},
journal={Applied Physics},
pages={277--230},
author={Graf, Johannes and Luk'jancuk, Boris S. and Mosbacher, Mario and Hong, Ming Hui and Chong, Chong T. and Boneberg, Johannes and Leiderer, Paul}
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<dcterms:abstract xml:lang="eng">In this paper a new laser-based technique for the removal of nanoparticles from silicon wafers, called matrix laser cleaning, is introduced. In contrast to the already existing technique dry laser cleaning damages of the substrate can be avoided. Furthermore no liquids are used, avoiding problems that occur, e.g. in steam laser cleaning and other wet cleaning techniques. We show that damage free particle removal of polystyrene particles with diameters of at least down to 50 nm is possible with a cleaning efficiency very close to 100% within a single shot experiment. Furthermore the cleaning threshold is independent of the particle size.</dcterms:abstract>
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